Spansion Inc. and United Microelectronics Corporation announced the joint development of a 40nm process that integrates UMC’s 40nm LP logic process with Spansion® proprietary embedded Charge Trap (eCT ...

As 40-nanometer NAND flash products are prepared for mass production, and as technologies emerge to achieve densities beyond 2 bits per cell (multilevel-cell technology), with 3- and 4-bit/cell ...

IM Flash’s 20-nm process is aimed at small form factor tablets, as well as smartphones, SSDs, and other consumer-oriented devices. Intel said it offers a 30 to 40 percent reduction in board ...

A world-first technology has been developed by introducing a roll-to-roll compatible flash process into secondary battery electrode manufacturing, significantly suppressing the performance degradation ...

Austriamicrosystems high-voltage CMOS process with embedded Flash is rated for 50 V. The Flash process technology is a modular extension of austriamicrosystems’ 0.35-μm CMOS process. Full ...

Taiwan Semiconductor Manufacturing Company (TSMC) has qualified its 0.13-micron embedded flash process and is set to begin production. According to a company release, TSMC is the first pure-play ...

The new 20nm process produces an 8-gigabyte (GB) multi-level cell (MLC) NAND flash device, providing a high-capacity, small form factor storage option for saving music, video, books and other data on ...

Hsinchu, Taiwan, December 21, 2017 – United Microelectronics Corporation (NYSE:UMC;TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced the availability of the company’s 40nm ...

Zhuhai, China -- February 27, 2020 -- Zhuhai Chuangfeixin’s Floating-gate eNOR Flash memory macro and SPI NOR flash are silicon characterized and qualified on Huali Microelectronics Corporation 55nm ...