BE Semiconductor Industries N.V. (the “Company” or “Besi”) (Euronext Amsterdam: BESI; OTC markets: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced ...

BE Semiconductor leads in die-attach tech for AI chips, with strong 2026–2028 growth expected from advanced packaging demand.

Amkor Technology (AMKR) may not be the flashiest name, but it is a key behind-the-scenes part of the global chip industry.

The valued size of the global semiconductor assembly equipment market was more than $3,599 million in 2020. The market is likely to grow at a CAGR of 8.2% during the forecast period from 2021 to 2027.

Tongfu Microelectronics, a major IC assembly and testing company in China, has posted sales that grew by 35.52% but saw profit drop by 47.53% amid the macroeconomic challenges and the cyclical ...

Hanmi Semiconductor announced on October 22 that it will participate in 'Semiconductor Exhibition (SEDEX) 2025,' held at COEX ...

Malaysia is building on its reputation for excellence in the semiconductor sector, turning the global chip shortage and ...

Put simply, we know that changes in temperatures impact electrical behavior of both wires and transistor-level devices. Similarly, mechanical stresses can also impact the circuitry behavior. When we ...

HONG KONG — Amid a downturn in its core IC-packaging and assembly business, Hong Kong's Asat Holdings Ltd. here today announced the retirement of the company's top executive and the divesture of its ...

The move to heterogeneous multi-chip/chiplet products improves yield, performance and modularity while reducing power and overall product footprint. However, this shift to heterogeneous assembly also ...

Amkor Technology Inc. today announced that it will open a semiconductor assembly and test manufacturing facility in China. The factory will produce packaged IC components for the cell phone, personal ...