The packaging of products is one of the most important aspects for every company. Well-thought-out and planned packaging techniques can inhibit or enhance sales. It is financially burdensome to a ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its full suite of Cadence ® digital, signoff and custom/analog IC design tools, along with advanced ...

LONDON--(BUSINESS WIRE)--The global aluminum foil packaging market research report by Technavio predicts the market to post a CAGR of close to 5% during the period 2018-2022. However, the growth ...

For more than 50 years, Moore’s Law has paced the advance of electronics, from semiconductor chips to laptops and cell phones. Now, the golden rule of technology price and performance from Intel ...

Wouldn’t the packaging for a big-screen TV be the perfect size for a TV stand? Yes, and a clever designer decided to do just that. We knew there were some tricky designers working on various packaging ...

Circle packing encapsulates the challenge of optimally arranging a set of circles within a given container without overlap, a process that has profound implications in both theoretical mathematics and ...