Compact heterogeneous systems are set to benefit from a RF silicon interposer platform that delivers low-loss, high-density ...
Microchip Technology introduced its BZPACK mSiC power module family at the recent APEC 2026. The series was designed to meet ...
The PFE1500FB is a third-generation 1500W AC/DC power module. It supports a wide input range of 85Vac to 305Vac, which uniquely allows it to operate on a 277Vac nominal input. This makes it highly ...
The relentless march of semiconductor scaling continues to reshape the packaging landscape, driven by Moore’s Law and the ...
Long before N SPACE TECH came into being, a simple yet profound question sparked its foundation — how do invisible radio ...
As system density increases, adaptable cable solutions are helping maintain signal integrity while allowing precise routing ...
TDK has introduced a third generation of its high‑power AC‑DC modules with the launch of the TDK‑Lambda PFE1500FB series, ...
Spirit Electronics, a vertically integrated electronics design and manufacturing solutions provider serving the military and aerospace markets, announced today that it has been designated as an ...
A new job posting from SpaceX mentions the company wants to develop compact 'multi-chip modules' to handle radio frequencies ...
Electronics distributor Richardson Electronics (NASDAQ:RELL) reported Q1 CY2026 results exceeding the market’s revenue ...
New COMs from congatec fast-track Intel Core Ultra Series 3 processors for embedded AI without discrete accelerator cards.
Siglents entry-level vector network analyzer series SNA5000X-E is now available on the european market. Covering frequency ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results