In case you missed it — we launched VECTOR® TEOS 3D! This breakthrough deposition tool is engineered to address the advanced packaging demands of next-generation AI and high-performance computing (HPC) applications. If this is your first time hearing about VECTOR® TEOS 3D, here’s a quick rundown. ⬇️ 📖 Blog Post: https://newsroom.lamresearch.com/everything-you-need-to-know-about-vector-teos-3d 🗞️ Press Release: https://investor.lamresearch.com/2025-09-09-Lam-Research-Introduces-VECTOR-R-TEOS-3D

As chips stack higher, the tolerance for defects shrinks. VECTOR® TEOS 3D enables single-pass deposition of ultra-thick dielectric films with crack-free quality, supporting the structural and yield demands of advanced packaging. Built to process high-bow wafers, it delivers the consistency required for today’s most complex 3D devices. The blog post explains more. https://bit.ly/3NcMZEK | Lam Research Corporation